Touch sensor and display device having the same

ABSTRACT

A touch sensor including a base layer including a sensing area and a non-sensing area, first and second sensor patterns disposed in the sensing area and arranged along first and second directions, respectively, first bridge patterns arranged along the first direction, second bridge patterns arranged along the second direction, and sensing lines disposed in the non-sensing area and connected to each of the first and second sensor patterns, in which each of the sensing lines includes a first metal layer and a second metal layer with an insulating layer interposed therebetween, each of the sensing lines has a first portion and a second portion, the second portion corresponding to at least one of the first bridge patterns disposed at a corner portion of the sensing area, and the second portion of at least one of the sensing lines has a single layer structure including only the second metal layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2019-0082276, filed on Jul. 8, 2019, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the invention relate generally to a touchsensor and a display device having the same.

Discussion of the Background

A touch sensor is a type of information input device, and may beprovided and used in a display device. For example, the touch sensor maybe attached to one surface of a display panel or may be manufacturedintegrally with the display panel. A user may input information bypressing or touching the touch sensor while viewing an image displayedon a screen of the display device.

The touch sensor may include a sensing area provided with sensorpatterns and a non-sensing area provided with sensing lines. In thiscase, differences in density of electrode patterns per unit area may bepresent in the sensing area provided with the sensor patterns and thenon-sensing area provided with the sensing lines. Due to the densitydifference of electrode patterns per unit area in the sensing area andthe non-sensing area, some components of the sensor patterns disposed ina specific area of the sensing area, for example, the width (orthickness) of a bridge, may be reduced. If the width of the bridge isreduced, short defects may occur in the specific area of the sensingarea, thereby reducing the sensing sensitivity of the touch sensor.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Touch sensors constructed according to exemplary embodiments of theinvention and display devices including the same are capable ofenhancing sensing sensitivity at a corner portion by forming at leastone sensing line adjacent to a bridge located at the corner portion ofthe sensing area as a single layer including a metal layer differentfrom the bridge, so that the density of electrode patterns per unit areain the sensing area is similar as that in the non-sensing area.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

A touch sensor according to an exemplary embodiment includes a baselayer including a sensing area and a non-sensing area, a plurality offirst sensor patterns disposed in the sensing area and arranged along afirst direction, a plurality of first bridge patterns arranged along thefirst direction, at least one of the first bridge patterns beingdisposed at a corner portion of the sensing area, a plurality of secondsensor patterns disposed in the sensing area and arranged along a seconddirection crossing the first direction, a plurality of second bridgepatterns arranged along the second direction, and a plurality of sensinglines disposed in the non-sensing area and connected to each of thefirst and second sensor patterns, in which each of the sensing linesincludes a first metal layer and a second metal layer disposed on thefirst metal layer with an insulating layer interposed therebetween, eachof the sensing lines has a first portion and a second portion, thesecond portion corresponding to the at least one of the first bridgepatterns, and the second portion of at least one of the sensing lineshas a single layer structure including only the second metal layer.

The first bridge patterns may be disposed on a layer different from alayer on which the first and second sensor patterns and the secondbridge patterns are disposed.

The first metal layer may be disposed on the same layer as the firstbridge patterns, and the second metal layer may be disposed on the samelayer as the first and second sensor patterns and the second bridgepatterns.

The insulating layer may include at least one contact hole, and thefirst metal layer and the second metal layer are electrically connectedthrough the at least one contact hole.

The first portion of the at least one of the sensing lines may have adouble layer structure including the first metal layer and the secondmetal layer overlapping the first metal layer.

The first portion of each of the sensing lines may have a double layerstructure including the first metal layer and the second metal layerdisposed on the first metal layer.

The first metal layer of each of the sensing lines may have the samesize. The same size may include one of the same width, the same length,or the same thickness.

The first metal layer of each of the sensing lines may have a differentsize from each other.

The size of the first metal layer of each of the sensing lines mayincrease as being disposed further away from the sensing area.

The second portion of each of the sensing lines may have a single layerstructure including only the second metal layer.

The second metal layer of each of the sensing lines may have the samesize. The same size may include one of the same width, the same length,or the same thickness.

The second metal layer of each of the sensing lines may have a differentsize from each other.

The second portion may overlap the at least one of the first bridgepatterns along the first direction.

Each of the sensing lines may include a third portion and a fourthportion extending in the first direction, the third portion maycorrespond to the first bridge patterns disposed in the same column asthe at least one of the first bridge patterns, and the third portion mayhave a single layer structure including only the second metal layer.

The fourth portion of each of the sensing lines that does not correspondto the first bridge patterns disposed in the same column as the at leastone of the first bridge patterns may have a double layer structureincluding the first metal layer and the second metal layer disposed onthe first metal layer.

A display device according to another exemplary embodiment includes adisplay panel including a plurality of pixels and an encapsulating layerdisposed on the plurality of pixels, each of the plurality of pixelsincluding a light emitting element, and a touch sensor disposed on theencapsulating layer, the touch sensor including a base layer including asensing area and a non-sensing area, a plurality of first sensorpatterns disposed in the sensing area and arranged along a firstdirection, a plurality of first bridge patterns arranged along the firstdirection, at least one of the first bridge patterns being disposed at acorner portion of the sensing area, a plurality of second sensorpatterns disposed in the sensing area and arranged along a seconddirection crossing the first direction, a plurality of second bridgepatterns arranged along the second direction, and a plurality of sensinglines disposed in the non-sensing area and connected to each of thefirst and second sensor patterns, in which each of the sensing linesincludes a first metal layer and a second metal layer disposed on thefirst metal layer with an insulating layer interposed therebetween, eachof the sensing lines has a first portion and a second portion, thesecond portion corresponding to the at least one of the first bridgepatterns, and the second portion of at least one of the sensing lineshas a single layer structure including only the second metal layer.

The first metal layer may be disposed on the same layer as the firstbridge patterns, and the second metal layer may be disposed on the samelayer as the first and second sensor patterns and the second bridgepatterns.

The first portion of each of the sensing lines may have a double layerstructure including the first metal layer and the second metal layerdisposed on the first metal layer.

The first metal layer of each of the sensing lines may have the samesize. The same size may include one of the same width, the same length,or the same thickness.

The display panel may include a substrate including a display areaprovided with the plurality of pixels and a non-display area disposed onat least one side of the display area. Each of the plurality of pixelscomprises a pixel circuit layer disposed on the substrate and includingat least one transistor; and a display element layer disposed on thepixel circuit layer and including the light emitting element emittinglight. The encapsulation layer may be disposed on the display elementlayer.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1A is a perspective view of a display device according to anexemplary embodiment.

FIG. 1B is a schematic cross-sectional view of the display device ofFIG. 1A.

FIG. 2 is a schematic plan view of a display panel of FIG. 1B.

FIG. 3A is an equivalent circuit diagram illustrating an electricalconnection relationship between components included in one pixel shownin FIG. 2.

FIG. 3B is an enlarged cross-sectional view of a portion of the displaypanel of FIG. 2.

FIG. 4 is a schematic cross-sectional view of a touch sensor of FIG. 1B.

FIG. 5 is a schematic plan view of the touch sensor of FIG. 1B.

FIG. 6 is an enlarged schematic plan view exemplarily illustrating aregion EA1 of FIG. 5.

FIG. 7A is a cross-sectional view taken along line I-I′ of FIG. 6.

FIG. 7B is an enlarged schematic plan view exemplarily illustrating aregion EA3 of FIG. 7A.

FIG. 8 is an enlarged schematic plan view exemplarily illustrating aregion EA2 of FIG. 5.

FIG. 9 is a cross-sectional view taken along line II-IP of FIG. 8.

FIG. 10 is a schematic plan view of a region of a corner portion of thetouch sensor of FIG. 5 illustrating only a second sensing line and afirst bridge adjacent thereto.

FIG. 11 is a cross-sectional view taken along line of FIG. 10.

FIG. 12 is a plan view of a region of a corner portion of the touchsensor of FIG. 5 illustrating a second sensing line and a first bridgeadjacent thereto according to another exemplary embodiment.

FIG. 13 is a plan view of a region of a corner portion of the touchsensor of FIG. 5 illustrating a second sensing line and a first bridgeadjacent thereto according to another exemplary embodiment.

FIG. 14 is a cross-sectional view taken along line IV-IV′ of FIG. 13.

FIG. 15 is a plan view of a region of a corner portion of the touchsensor of FIG. 5 illustrating a second sensing line and a first bridgeadjacent thereto according to another exemplary embodiment.

FIG. 16 is a cross-sectional view taken along line V-V′ of FIG. 15.

FIG. 17 is a plan view of a region of a corner portion of the touchsensor of FIG. 5 illustrating a first sensing line and a first bridgeadjacent thereto.

FIG. 18 is a cross-sectional view taken along line VI-VI′ of FIG. 17.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1A is a perspective view of a display device according to anexemplary embodiment. FIG. 1B is a schematic cross-sectional view of thedisplay device of FIG. 1A.

Referring to FIGS. 1A and 1B, a display device DD may include a displaymodule DM and a window WD.

The display device DD may be provided in various shapes. For example,the display device DD may be provided as a rectangular plate having twopairs of sides substantially parallel to each other. However, theinventive concepts are not limited thereto. For example, when thedisplay device DD has a rectangular plate shape, one of two pairs of thesides may be longer than the other pair of the sides. Hereinafter, thedisplay device DD will be described as having a rectangular shape thathas a pair of long sides and a pair of short sides. An extensiondirection of the long sides is indicated by a second direction DR2, anextension direction of the short sides is indicated by a first directionDR1, and a direction perpendicular to the extension directions of thelong side and the short side is indicated by a third direction DR3. Asdescribed above, in the display device DD having the rectangular plateshape, a corner portion where one long side and one short side meet eachother may have a round shape.

According to an exemplary embodiment, at least a portion of the displaydevice DD may have flexibility, and the display device DD may be foldedat the portion having the flexibility.

The display device DD may include a display area DD_DA for displaying animage and a non-display area DD_NDA provided on at least one side of thedisplay area DD_DA. The non-display area DD_NDA may be an area where noimage is displayed.

In some exemplary embodiments, the display device DD may include asensing area SA and a non-sensing area NSA. The display device DD maydisplay an image through the sensing area SA, and may also detect lightincident from the front. The non-sensing area NSA may surround thesensing area SA, but the inventive concepts are not limited thereto. InFIG. 1A, the sensing area SA is illustrated as having a shape thatincludes rounded corners and corresponding to the display area DD_DA.However, the inventive concepts are not limited thereto, and in someexemplary embodiments, a portion of the display area DD_DA maycorrespond to the sensing area SA.

The shape, size, and arrangement position of the sensing area SA of thedisplay device DD described above may be variously modified according tosensor electrodes to be described later.

The display module DM may include a display panel DP and a touch sensorTS. The touch sensor TS may be disposed directly on the display panel DPor disposed on the display panel DP with a separate layer, such as anadhesive layer or a substrate, interposed therebetween.

The display panel DP may display an image. As the display panel DP, adisplay panel capable of self-emission, such as an organic lightemitting diode (OLED) display panel, may be used. However, the inventiveconcepts are not limited thereto, and in some exemplary embodiments, anon-light emitting display panel, such as a liquid crystal display (LCD)panel, an electro-phoretic display (EPD) panel, and an electro-wettingdisplay (EWD) panel, may be used as the display panel DP. When thenon-light emitting display panel is used as the display panel DP, thedisplay device DD may include a backlight unit that supplies light tothe display panel DP.

The touch sensor TS may be disposed on a surface, on which the image ofthe display panel DP is emitted, to receive a user's touch input. Thetouch sensor TS may recognize a touch event of the display device DDthrough a user's hand or a separate input means. The touch sensor TS mayrecognize the touch event in a capacitance manner. However, theinventive concepts are not limited thereto, and in some exemplaryembodiments, the touch sensor TS may detect the touch input in a mutualcapacitance manner or in a self-capacitance manner.

A window WD may be provided on the display module DM to protect theexposed surface of the display module DM. The window WD may protect thedisplay module DM from external shock, and provide a user with an inputsurface and/or a display surface. The window WD may be coupled to thedisplay module DM by an optically clear adhesive (OCA) member.

The window WD may have a multi-layer structure, and may include at leastone of a glass substrate, a plastic film, and a plastic substrate. Themulti-layer structure may be formed through a continuous process or anadhesive process using an adhesive layer. All or part of the window WDmay have flexibility.

FIG. 2 is a schematic plan view of the display panel of FIG. 1B.

Referring to FIGS. 1A, 1B and 2, the display panel DP may include asubstrate SUB, pixels PXL provided on the substrate SUB, a driverdisposed on the substrate SUB and driving the pixels PXL, and a wiringportion connecting the pixels PXL and the driver.

The substrate SUB may be formed as one part having substantially arectangular shape. However, the inventive concepts are not limitedthereto, and in some exemplary embodiments, the substrate SUB may beformed as multiple parts, and the substrate SUB may have a differentshape depending on the number of parts of the substrate SUB.

The substrate SUB may include an insulating material, such as glass andresin. In addition, the substrate SUB may include a flexible material soas to be bent or folded, and may have a single layer structure or amulti-layer structure. For example, the flexible material may include atleast one of polystyrene, polyvinyl alcohol, polymethyl methacrylate,polyethersulfone, polyacrylate, polyetherimide, polyethylenenaphthalate, polyethylene terephthalate, polyphenylene sulfide,polyarylate, polyimide, polycarbonate, triacetate cellulose, andcellulose acetate propionate. The material forming the substrate SUB maybe variously changed. For example, in some exemplary embodiments, thesubstrate SUB may include fiber glass reinforced plastic (FRP).

The substrate SUB may include a display area DA and a non-display areaNDA. The display area DA may be an area, in which the pixels PXL areprovided to display an image. The non-display area NDA may be an area,in which the pixels PXL are not provided, and thus, an image may not bedisplayed. Although only one pixel PXL is illustrated in FIG. 2,however, a plurality of pixels PXL may be disposed in the display areaDA of the substrate SUB.

The display area DA of the display panel DP may correspond to thedisplay area DD_DA of the display device DD, and the non-display areaNDA of the display panel DP may correspond to the non-display areaDD_NDA of the display device DD.

The driver for driving the pixels PXL and a portion of the wiringportion connecting the pixels PXL and the driver may be provided in thenon-display area NDA. The non-display area NDA may correspond to a bezelarea of the display device DD.

The pixels PXL may be provided in the display area DA of the substrateSUB. Each of the pixels PXL may be a minimum unit for displaying animage. The pixels PXL may include an organic light emitting diode thatemits white light and/or color light. Each of the pixels PXL may emitone of red, green, and blue colors. However, the inventive concepts arenot limited thereto, and in some exemplary embodiments, the pixels PXLmay emit color light, such as cyan, magenta, and yellow.

The pixels PXL may be arranged in a matrix form along a row extending inthe first direction DR1 and a column extending in the second directionDR2 crossing the first direction DR1. However, the arrangement of thepixels PXL is not particularly limited, and may be arranged in variousforms.

The driver may supply a signal to each of the pixels PXL through thewiring portion, and control the driving of the pixels PXL. In FIG. 2,the wiring portion is not illustrated, and the wiring portion will bedescribed in more detail with reference to FIG. 3A.

The driver may include a scan driver SDV for transmitting a scan signalto each of the pixels PXL through a scan line, a light emission driverEDV for providing a light emission control signal to each of the pixelsPXL through a light emission control line, and a data driver DDVproviding a data signal to each of the pixels PXL through a data line,and a timing controller. The timing controller may control the scandriver SDV, the light emission driver EDV, and the data driver DDV.

FIG. 3A is an equivalent circuit diagram illustrating an electricalconnection relationship between components included in one pixel shownin FIG. 2.

Referring to FIGS. 1A, 1B, 2 and 3A, each of the pixels PXL may includea light emitting element OLED and a pixel circuit PC for driving thelight emitting element OLED. According to an exemplary embodiment, thelight emitting element OLED may include an organic light emitting diode(OLED).

The pixel circuit PC may be connected to an i^(th) scan line Si and ai^(th) data line Dj of the corresponding pixel PXL. For example, whenthe pixel PXL is disposed in an i^(th) (“i” is a natural number) row anda j^(th) (“j” is a natural number) column of the display area DA of thedisplay panel DP, the pixel circuit PC of the pixel PXL may be connectedto the i^(th) scan line Si and the j^(th) data line Dj of the displayarea DA. In some exemplary embodiments, the pixel circuit PC may befurther connected to at least one other scan line. For example, onepixel PXL disposed in the i^(th) row of the display area DA of thedisplay panel DP may be further connected to an (i−1)^(th) scan lineSi−1 and/or an (i+1)^(th) scan line Si+1. In some exemplary embodiments,the pixel circuit PC may be further connected to a third power source inaddition to first and second pixel power sources ELVDD and ELVSS. Forexample, the pixel circuit PC may be connected to an initializationpower source Vint.

The pixel circuit PC may include first to seventh transistors T1 to T7and a storage capacitor Cst.

One electrode of the first transistor T1 (for example, a drivingtransistor), for example, a source electrode may be connected to a powersource line, to which the first pixel power source ELVDD is applied, viathe fifth transistor T5, and another electrode, for example, a drainelectrode, may be connected to the light emitting element OLED via thesixth transistor T6. A gate electrode of the first transistor T1 may beconnected to a first node N1. The first transistor T1 may control adriving current flowing between the first pixel power source ELVDD andthe second pixel power source ELVSS via the light emitting element OLEDaccording to the voltage of the first node N1.

The second transistor T2 (for example, a switching transistor) may beconnected between the j^(th) data line Dj connected to the pixel PXL andthe source electrode of the first transistor T1. A gate electrode of thesecond transistor T2 may be connected to the i^(th) scan line Siconnected to the pixel PXL. The second transistor T2 may be turned onwhen a scan signal of a gate-on voltage (for example, a low voltage) issupplied from the i^(th) scan line Si to electrically connect the j^(th)data line Dj to the source electrode of the first transistor T1. Whenthe second transistor T2 is turned on, the data signal supplied from thej^(th) data line Dj is transferred to the first transistor T1.

The third transistor T3 may be connected between the drain electrode ofthe first transistor T1 and the first node N1. A gate electrode of thethird transistor T3 may be connected to the i^(th) scan line Si. Thethird transistor T3 may be turned on when the scan signal of the gate-onvoltage is supplied from the i^(th) scan line Si to electrically connectthe drain electrode of the first transistor T1 to the first node N1.

The fourth transistor T4 may be connected between the first node N1 andan initialization power source line, to which the initialization powersource Vint is applied. A gate electrode of the fourth transistor T4 maybe connected to a previous scan line, for example, the (i−1)^(th) scanline Si−1. The fourth transistor T4 may be turned on when the scansignal of the gate-on voltage is supplied to the (i−1)^(th) scan lineSi−1 to transfer the voltage of the initialization power source Vint tothe first node N1. Here, the initialization power source Vint may have avoltage less than or equal to the lowest voltage of the data signal.

The fifth transistor T5 may be connected between the first pixel powersource ELVDD and the first transistor T1. A gate electrode of the fifthtransistor T5 may be connected to a corresponding emission control line,for example, an i^(th) emission control line Ei. The fifth transistor T5may be turned off when an emission control signal of a gate-off voltageis supplied to the i^(th) emission control line Ei, and may be turned onotherwise.

The sixth transistor T6 may be connected between the first transistor T1and the light emitting element OLED. A gate electrode of the sixthtransistor T6 may be connected to the i^(th) emission control line Ei.The sixth transistor T6 may be turned off when the emission controlsignal of the gate-off voltage is supplied to the i^(th) emissioncontrol line Ei, and may be turned otherwise.

The seventh transistor T7 may be connected between the light emittingelement OLED and the initialization power source line, to which theinitialization power source Vint is applied. A gate electrode of theseventh transistor T7 may be connected to any one of the next scanlines, for example, the (i+1)^(th) scan line Si+1. The seventhtransistor T7 may be turned on when the scan signal of the gate-onvoltage is supplied to the (i+1)^(th) scan line Si+1 to supply thevoltage of the initialization power source Vint to the light emittingelement OLED.

The storage capacitor Cst may be connected between the first pixel powersource ELVDD and the first node N1. The storage capacitor Cst may storea voltage corresponding to a data signal supplied to the first node N1in each frame period and a threshold voltage of the first transistor T1.

An anode electrode of the light emitting element OLED may be connectedto the first transistor T1 via the sixth transistor T6, and a cathodeelectrode of the light emitting element OLED may be connected to thesecond pixel power source ELVSS. The light emitting element OLED maygenerate light having a predetermined luminance in response to theamount of current supplied from the first transistor T1. The voltage ofthe first pixel power source ELVDD may be set higher than that of thesecond pixel power source ELVSS, so that a current may flow to the lightemitting element OLED. The potential difference between the first pixelpower source ELVDD and the second pixel power source ELVSS may be set tobe equal to or greater than a threshold voltage of the light emittingelement OLED during an emission period of the pixel PXL.

FIG. 3B is an enlarged cross-sectional view of a portion of the displaypanel of FIG. 2.

In FIG. 3B, only cross-sectional views of portions corresponding to thesecond and sixth transistors among the first to seventh transistorsillustrated in FIG. 3A are exemplarily illustrated.

Referring to FIGS. 1A, 1B, 2, 3A and 3B, the display panel DP mayinclude the substrate SUB, a pixel circuit layer PCL, a display elementlayer DPL, and a thin film encapsulation layer TFE.

The substrate SUB may include an insulating material, such as glass,organic polymer, quartz, or the like. In addition, the substrate SUB mayinclude a flexible material so as to be bent or folded, and may have asingle layer structure or a multi-layer structure.

The pixel circuit layer PCL may include a buffer layer BFL, the secondand sixth transistors T2 and T6, and a passivation layer PSV.

The buffer layer BFL may be provided on the substrate SUB, and mayprevent impurities from being diffused into the second and sixthtransistors T2 and T6. The buffer layer BFL may be provided as a singlelayer or a multilayer of at least two or more layers. In some exemplaryembodiments, the buffer layer BFL may be omitted depending on materialsand process conditions of the substrate SUB.

Each of the second and sixth transistors T2 and T6 may include asemiconductor layer SCL, a gate electrode GE, a source electrode SE, anda drain electrode DE.

The semiconductor layer SCL of each of the second and sixth transistorsT2 and T6 may be provided on the buffer layer BFL. The semiconductorlayer SCL may include source and drain regions contacting the sourceelectrode SE and the drain electrode DE, respectively. A region betweenthe source region and the drain region may be a channel region.

The semiconductor layer SCL may be a semiconductor pattern includingpolysilicon, amorphous silicon, an oxide semiconductor, or the like. Thechannel region may be an intrinsic semiconductor pattern that is notdoped with impurities. In this case, impurities, such as n-typeimpurities, p-type impurities, and metal impurities, may be used. Thesource and drain regions may be semiconductor patterns doped withimpurities.

The gate electrode GE of each of the second and sixth transistors T2 andT6 may be provided on the corresponding semiconductor layer SCL with agate insulating layer GI interposed therebetween.

The source electrode SE of each of the second and sixth transistors T2and T6 may be in contact with the source region of the correspondingsemiconductor layer SCL through a contact hole passing through aninterlayer insulating layer ILD and the gate insulating layer GI. Forexample, the source electrode SE of the second transistor T2 may be incontact with the source region of the corresponding semiconductor layerSCL through a first contact hole CH1 passing through the interlayerinsulating layer ILD and the gate insulating layer GI, and the sourceelectrode SE of the sixth transistor T6 may be in contact with thesource region of the corresponding semiconductor layer SCL through athird contact hole CH3 passing through the interlayer insulating layerILD and the gate insulating layer GI.

The drain electrode DE of each of the second and sixth transistors T2and T6 may be in contact with the drain region of the correspondingsemiconductor layer SCL through a contact hole passing through theinterlayer insulating layer ILD and the gate insulating layer GI. Forexample, the drain electrode DE of the second transistor T2 may be incontact with the drain region of the corresponding semiconductor layerSCL through a second contact hole CH2 passing through the interlayerinsulating layer ILD and the gate insulating layer GI, and the drainelectrode DE of the sixth transistor T6 may be in contact with the drainregion of the corresponding semiconductor layer SCL through a fourthcontact hole CH4 passing through the interlayer insulating layer ILD andthe gate insulating layer GI.

According to an exemplary embodiment, each of the interlayer insulatinglayer ILD and the gate insulating layer GI may be formed of an inorganicinsulating film including an inorganic material, or an organicinsulating film including an organic material.

The passivation layer PSV may be provided on the second and sixthtransistors T2 and T6 to cover the second and sixth transistors T2 andT6. The passivation layer PSV may include a fifth contact hole CH5exposing a portion of the drain electrode DE of the sixth transistor T6to the outside.

The display element layer DPL may include the light emitting elementOLED provided on the passivation layer PSV and emitting light.

The light emitting element OLED may include first and second electrodesAE and CE and a light emitting layer EML provided between the first andsecond electrodes AE and CE. One of the first and second electrodes AEand CE may be the anode electrode, and the other may be the cathodeelectrode. For example, the first electrode AE may be the anodeelectrode and the second electrode CE may be the cathode electrode. Whenthe light emitting element OLED is a top emission organic light emittingdevice, the first electrode AE may be a reflective electrode and thesecond electrode CE may be a transmissive electrode. Hereinafter, thelight emitting element OLED will exemplarily be described as a topemission organic light emitting device, and in this case, the firstelectrode AE may be the anode electrode.

The first electrode AE may be electrically connected to the drainelectrode DE of the sixth transistor T6 through the fifth contact holeCH5 penetrating the passivation layer PSV. The first electrode AE mayinclude a reflective film capable of reflecting light, and a transparentconductive film disposed above or below the reflective film. At leastone of the transparent conductive film and the reflective film may beelectrically connected to the drain electrode DE of the sixth transistorT6.

The display element layer DPL may further include a pixel defining layerPDL having an opening OP that exposes a portion of the first electrodeAE, for example, an upper surface of the first electrode AE.

Each pixel PXL provided in the display panel DP may be disposed in apixel area included in the display area DA. According to an exemplaryembodiment, the pixel area may include a light emitting area EMA and anon-light emitting area NEMA adjacent to the light emitting area EMA.The non-light emitting area NEMA may surround the light emitting areaEMA. In the illustrated exemplary embodiment, the light emitting areaEMA may be defined to correspond to a portion of the first electrode AEexposed by the opening OP.

The display element layer DPL may include a hole control layer HCL andan electron control layer ECL.

The hole control layer HCL may be disposed in common in the lightemitting area EMA and the non-light emitting area NEMA. In someexemplary embodiments, a common layer, such as the hole control layerHCL, may be commonly formed in the plurality of pixels PXL.

The light emitting layer EML may be disposed on the hole control layerHCL. The light emitting layer EML may be disposed in a regioncorresponding to the opening OP. More particularly, the light emittinglayer EML may be provided in each of the plurality of pixels PXL. Thelight emitting layer EML may include an organic material and/or aninorganic material. In the illustrated exemplary embodiment of thepresent invention, the light emitting layer EML is illustrated as beingpatterned in each pixel PXL, however, in some exemplary embodiments, thelight emitting layer EML may be commonly provided in the pixels PXL. Thecolor of light generated in the light emitting layer EML may be one ofred, green, blue, and white, but the inventive concepts are not limitedthereto. For example, the color of light generated in the light emittinglayer EML may be one of magenta, cyan, and yellow.

The electron control layer ECL may be provided on the light emittinglayer EML. The electron control layer ECL may be commonly formed in thepixels PXL, and may inject and/or transport electrons to the lightemitting layer EML.

The second electrode CE may be provided on the electron control layerECL. The second electrode CE may be commonly provided in the pixels PXL.

The thin film encapsulation layer TFE may be provided on the secondelectrode CE to cover the second electrode CE.

The thin film encapsulation layer TFE may be formed of a single layer,or multiple layers. The thin film encapsulation layer TFE may include aplurality of insulating layers covering the light emitting element OLED.In particular, the thin film encapsulation layer TFE may include atleast one inorganic layer and at least one organic layer. For example,the thin film encapsulation layer TFE may have a structure, in which aninorganic layer and an organic layer are alternately stacked. In anotherexemplary embodiment, the thin film encapsulation layer TFE may be anencapsulation substrate disposed on the light emitting element OLED andbonded to the substrate SUB through a sealant.

FIG. 4 is a schematic cross-sectional view of a touch sensor of FIG. 1B.

Referring to FIGS. 1A, 1B, 2, 3A, 3B and 4, the touch sensor TS mayinclude a base layer BSL, a first conductive pattern CP1, a firstinsulating layer INS1, a second conductive pattern CP2, and a secondinsulating layer INS2.

The first conductive pattern CP1 may be directly disposed on the baselayer BSL, which may be an insulation layer disposed between the firstconductive pattern CP1 and the thin film encapsulation layer TFE of thedisplay panel DP, but the inventive concepts are not limited thereto. Insome exemplary embodiments, the first conductive pattern CP1 may bedisposed directly on the thin film encapsulation layer TFE of thedisplay panel DP. In some exemplary embodiments, the base layer BSL maybe an uppermost layer of the thin film encapsulation layer TFE.

Each of the first and second conductive patterns CP1 and CP2 may have asingle layer structure or a multi-layer structure stacked in a thicknessdirection. The conductive pattern of the single layer structure mayinclude a metal layer or a transparent conductive layer. The metal layermay include molybdenum, silver, titanium, copper, aluminum, or alloysthereof. The transparent conductive layer may include a transparentconductive oxide, such as indium tin oxide (ITO), indium zinc oxide(IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or the like. Inaddition, the transparent conductive layer may include PEDOT, metalnanowires, and graphene.

The conductive pattern of the multi-layer structure may includemulti-layered metal layers. The multi-layered metal layers may have atriple-layer structure, for example, titanium/aluminum/titanium. Theconductive pattern of the multi-layer structure may include a singlemetal layer and a single transparent conductive layer. The conductivepattern of the multi-layer structure may include multi-layered metallayers and multi-layered transparent conductive layers.

According to an exemplary embodiment, each of the first and secondconductive patterns CP1 and CP2 may include sensor patterns and sensinglines.

Each of the first insulating layer INS1 and the second insulating layerINS2 may include an inorganic insulating film including an inorganicmaterial, or an organic insulating film including an organic material.The inorganic insulating film may include at least one of aluminumoxide, titanium oxide, silicon oxide, or silicon nitride, siliconoxynitride, zirconium oxide, and hafnium oxide. The organic insulatingfilm may include at least one of acrylic resin, methacrylic resin,polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin,siloxane resin, polyimide resin, polyamide resin, and perylene resin.

FIG. 5 is a schematic plan view of the touch sensor of FIG. 1B. FIG. 6is an enlarged schematic plan view exemplarily illustrating a region EA1of FIG. 5. FIG. 7A is a cross-sectional view taken along line I-I′ ofFIG. 6. FIG. 7B is an enlarged schematic plan view exemplarilyillustrating a region EA3 of FIG. 7A.

Referring to FIGS. 1A to 7B, the touch sensor TS may include the baselayer BSL including the sensing area SA capable of sensing a touchinput, and the non-sensing area NSA surrounding at least a portion ofthe sensing area SA.

The base layer BSL may be made of tempered glass, transparent plastic,transparent film, or the like.

The sensing area SA may be provided in a center area of the base layerBSL and overlap the display area DA of the display panel DP. The sensingarea SA may have substantially the same shape as that of the displayarea DA, but the inventive concepts are not limited thereto. Sensorelectrodes for sensing a touch input are provided and/or formed in thesensing area SA.

The non-sensing area NSA may be provided at an edge of the base layerBSL and overlap the non-display area NDA of the display panel DP.Sensing lines SL electrically connected to the sensor electrodes toreceive and transmit a touch sensing signal may be provided and/orformed in the non-sensing area NSA. In addition, a pad portion PDAconnected to the sensing lines SL and electrically connected to thesensor electrodes of the sensing area SA may be disposed in thenon-sensing area NSA. The pad portion PDA may include a plurality ofpads PD.

The sensor electrode may include a plurality of sensor patterns SP andfirst and second bridge patterns BRP1 and BRP2.

The sensor patterns SP may include a plurality of first sensor patternsSP1 and a plurality of second sensor patterns SP2 electrically insulatedfrom the first sensor patterns SP1.

The first sensor patterns SP1 may be arranged in the first direction DR1and electrically connected to the adjacent first sensor patterns SP1 bythe first bridge patterns BRP1 to form at least one sensor row. Thesecond sensor patterns SP2 may be arranged in the second direction DR2crossing the first direction DR1 and electrically connected to theadjacent second sensor patterns SP2 through the second bridge patternsBRP2 to form at least one sensor column.

Each of the first and second sensor patterns SP1 and SP2 may beelectrically connected to each pad PD through the corresponding sensingline SL.

According to an exemplary embodiment, the touch sensor TS may recognizea user's touch by sensing the amount of change in the capacitance formedbetween the first and second sensor patterns SP1 and SP2.

According to an exemplary embodiment, each of the second sensor patternsSP2 may include a plurality of conductive thin lines CFL1 and CFL2 asshown in FIG. 7B. For example, the second sensor patterns SP2 mayinclude the plurality of first conductive thin lines CFL1 parallel toeach other and extending in an oblique direction with respect to thefirst direction DR1, and the plurality of second conductive thin linesCFL2 parallel to each other and extending in an oblique direction withrespect to the second direction DR2. Due to the first conductive thinlines CFL1 and the second conductive thin lines CFL2, each of the secondsensor patterns SP2 may have a mesh structure. The mesh structure mayinclude a plurality of openings, for example, regions in which the firstconductive thin lines CFL1 and the second conductive thin lines CFL2cross each other.

In the drawing, each of the second sensor patterns SP2 is illustrated ashaving a mesh structure, but the inventive concepts are not limitedthereto. For example, in some exemplary embodiments, the first sensorpatterns SP1 and the first and second bridge patterns BRP1 and BRP2 mayalso have a mesh structure including the first and second conductivethin lines CFL1 and CFL2.

When the first and second sensor patterns SP1 and SP2 have a meshstructure, an area where the first and second sensor patterns SP1 andSP2 overlap the display panel DP may be reduced by the openings. In thismanner, electromagnetic interference between the first and second sensorpatterns SP1 and SP2 and the display panel DP may be prevented or atleast be suppressed.

Each of the first bridge patterns BRP1 electrically connects the firstsensor patterns SP1 arranged side by side along the first direction DR1.Each of the first bridge patterns BRP1 may also be provided to extend inthe first direction DR1. Each of the first bridge patterns BRP1 mayinclude a (1-1)^(th) bridge pattern BRP1_1 and a (1-2)^(th) bridgepattern BRP1_2.

Each of the second bridge patterns BRP2 electrically connects the secondsensor patterns SP2 arranged side by side along the second directionDR2. Each of the second bridge patterns BRP2 may also be provided toextend in the second direction DR2. According to an exemplaryembodiment, the second bridge patterns BRP2 may be integrally providedwith the second sensor patterns SP2. When the second bridge patternsBRP2 are integrally provided with the second sensor patterns SP2, thesecond bridge patterns BRP2 may be one region of the second sensorpatterns SP2.

The touch sensor TS may include the first conductive pattern CP1disposed on the base layer BSL as shown in FIG. 4, the first insulatinglayer INS1 disposed on the first conductive pattern CP1, the secondconductive pattern CP2 disposed on the first insulating layer INS1, andthe second insulating layer INS2 disposed on the second conductivepattern CP2.

The base layer BSL may be disposed on the thin film encapsulation layerTFE of the display panel DP. The base layer BSL may include an organicinsulating film including an organic material, or an inorganicinsulating film including an inorganic material. In an exemplaryembodiment, the base layer BSL may include a material that is flexibleso as to be bent or folded, and may have a single layer structure or amulti-layer structure. In order to implement a touch screen function,the touch sensor TS may be combined with the display panel DP displayingan image. Accordingly, the touch sensor TS may have transparency thatmay transmit light.

In some exemplary embodiments, the base layer BSL may be an uppermostlayer of the thin film encapsulation layer TFE of the display panel DP.For example, the base layer BSL may be an inorganic insulating layer (oran inorganic layer) that is an uppermost layer of the thin filmencapsulation layer TFE. In some exemplary embodiments, the base layerBSL may be an inorganic insulating layer (e.g., inorganic buffer layer)additionally disposed on the thin film encapsulation layer TFE. Forexample, the base layer BSL may include a silicon nitride layer, asilicon oxy nitride layer, a silicon oxide layer, a titanium oxidelayer, an aluminum oxide layer, or the like.

The first conductive pattern CP1 may be directly disposed on the baselayer BSL. In some exemplary embodiments, the first conductive patternCP1 may be disposed to overlap the pixel defining layer PDL.

The first conductive pattern CP1 may include the first bridge patternsBRP1 as shown in FIGS. 6 and 7A.

The first conductive pattern CP1 may include a conductive material. Theconductive material may include a transparent conductive oxide or ametal material. In addition, the first conductive pattern CP1 mayinclude a plurality of stacked metal layers. Examples of the transparentconductive oxide include indium tin oxide (ITO), indium zinc oxide(IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zincoxide (ZnO), and tin oxide (SnO₂). Examples of the metal materialinclude copper, silver, gold, platinum, palladium, nickel, tin,aluminum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese,molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony,and lead. The first conductive pattern CP1 may have a single layerstructure or a multi-layer structure.

The first insulating layer INS1 may be provided on the first conductivepattern CP1. The first insulating layer INS1 may include substantiallythe same material as the base layer BSL, without being limited thereto.In an exemplary embodiment, the first insulating layer INS1 may includean organic insulating film including an organic material, or aninorganic insulating film including an inorganic material.

The second conductive pattern CP2 may include a single conductivematerial layer or a plurality of stacked conductive material layers assimilar to the first conductive pattern CP1. As shown in FIGS. 4, 6, and7A, the second conductive pattern CP2 may include first and secondsensor patterns SP1 and SP2, and second bridge patterns BRP2 provided onthe first insulating layer INS1. The first sensor patterns SP1 adjacentin the first direction DR1 may be electrically and/or physicallyconnected to each other by the first bridge patterns BRP1 formed incontact holes CNT passing through the first insulating layer INS1.

The second insulating layer INS2 may be disposed on the first insulatinglayer INS1, on which the second conductive pattern CP2 is disposed. Thesecond insulating layer INS2 may prevent the second conductive patternCP2 from being exposed to the outside, thereby preventing corrosion ofthe second conductive pattern CP2. The second insulating layer INS2 maybe formed of an organic insulating film including an organic material.The organic material may include one of acryl, polyimide (PI), polyamide(PA), and benzocyclobutene (BCB). The second insulating layer INS2 madeof an organic insulating film may be transparent and have fluidity, sothat the curvature of the lower structure may be alleviated andflattened. In some exemplary embodiments, the second insulating layerINS2 may be formed of an inorganic insulating film including aninorganic material.

According to the illustrated exemplary embodiment, the first bridgepatterns BRP1 is described as being included in the first conductivepattern CP1, and the first and second sensor patterns SP1 and SP2 andthe second bridge patterns BRP2 are described as being included in thesecond conductive patterns CP2, however, the inventive concepts are notlimited thereto. In some exemplary embodiments, the first and secondsensor patterns SP1 and SP2 and the second bridge patterns BRP2 may beincluded in the first conductive pattern CP1, and the first bridgepatterns BRP1 may be included in the second conductive pattern CP2. Moreparticularly, the first and second sensor patterns SP1 and SP2 and thesecond bridge patterns BRP2 may be formed and/or provided on the baselayer BSL, and the first bridge patterns BRP1 may be formed and/orprovided on first insulating layer INS1. Even in this case, each of thefirst sensor patterns SP1 may be connected to the corresponding firstbridge patterns BRP1 through the contact hole CNT passing through thefirst insulating layer INS1, and may be electrically and/or physicallyconnected to the first sensor patterns SP1 disposed adjacent to eachother in the first direction DR1.

In an exemplary embodiment, the first conductive pattern CP1 may beprovided on the base layer BSL, and the second conductive pattern CP2may be provided on the first insulating layer INS1. However, theinventive concepts are not limited thereto. For example, in someexemplary embodiments, the first conductive pattern CP1 may be providedon the first insulating layer INS1, and the second conductive patternCP2 may be provided on the base layer BSL.

In addition, the first and second sensor patterns SP1 and SP2 accordingto the illustrated exemplary embodiment are described as being disposedon the same layer, but the inventive concepts are not limited thereto.In some exemplary embodiments, the first sensor patterns SP1 and thesecond sensor patterns SP2 may be provided on different layers from eachother.

The first and second sensor patterns SP1 and SP2 and the first andsecond bridge patterns BRP1 and BPR2 as described above may be formed ofa light transmissive conductive layer, such as ITO, IZO, or ZnO.

The sensor electrode provided and/or formed in the sensing area SA mayinclude dummy electrodes disposed to be spaced apart between the firstand second sensor patterns SP1 and SP2. The dummy electrodes are notelectrically connected to the first sensor patterns SP1 and the secondsensor patterns SP2 as floating electrodes. As the dummy electrodes aredisposed in the sensing area SA, the boundary area between the firstsensor patterns SP1 and the second sensor patterns SP2 may not be seenby a user. In addition, a fringe effect between the first sensorpatterns SP1 and the second sensor patterns SP2 may be controlled byadjusting the width and thickness of the dummy electrodes, and in thismanner, the capacitance between the first sensor patterns SP1 and thesecond sensor patterns SP2 may be optimized.

As shown in FIG. 6, the touch sensor TS may be configured in arepetitive arrangement of a unit sensor block USB. The unit sensor blockUSB may be a virtual unit block having a predetermined area including atleast a portion of the neighboring first sensor patterns SP1 and atleast a portion of the neighboring second sensor patterns SP2. The unitsensor block USB may correspond to a minimum repeating unit of thearrangement pattern of the first and second sensor patterns SP1 and SP2.The unit sensor block USB may be a minimum unit of image capturing forinspecting defects in the touch sensor TS. Defects of the touch sensorTS may be detected by photographing an image corresponding to the unitsensor block USB for each region, and comparing the photographed images.In this case, the minimum unit of image capturing for the defectinspection may correspond to the unit sensor block USB.

According to an exemplary embodiment, the sensing lines SL may include aplurality of first sensing lines SL1 connected to the first sensorpatterns SP1, and a plurality of second sensing lines SL2 connected tothe second sensor patterns SP2.

The first sensing lines SL1 may be connected to the first sensorpatterns SP1. Each of the first sensing lines SL1 may be connected toone sensor row formed by the plurality of first sensor patterns SP1disposed along the first direction DR1. In a plan view, the firstsensing lines SL1 may be bent at least once in the non-sensing area NSA.The first sensing lines SL1 may include a portion extending along thefirst direction DR1 and a portion extending along the second directionDR2.

The second sensing lines SL2 may be connected to the second sensorpatterns SP2. Each of the second sensing lines SL2 may be connected toone sensor column formed by the plurality of second sensor patterns SP2disposed along the second direction DR2. In a plan view, the secondsensing lines SL2 may be bent at least once in the non-sensing area NSA.The second sensing lines SL2 may include a portion extending along thefirst direction DR1 and a portion extending along the second directionDR2.

The first and second sensing lines SL1 and SL2 may be made of aconductive material. As the conductive material, metals, alloys thereof,conductive polymers, conductive metal oxides, nano conductive materials,and the like may be used. In an exemplary embodiment, the metals mayinclude copper, silver, gold, platinum, palladium, nickel, tin,aluminum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese,molybdenum, tungsten, niobium, tantal, titanium, bismuth, antimony, leadand the like. Examples of the conductive polymer may includepolythiophene-based compounds, polypyrrole-based compounds,polyaniline-based compounds, polyacetylene-based compounds,polyphenylene-based compounds, and mixtures thereof. In particular,PEDOT/PSS compounds may be used among polythiophene-based compounds.Examples of the conductive metal oxide may include indium tin oxide(ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tinzinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO₂), and the like. Inaddition, the nano conductive materials may include silver nanowires(AgNW), carbon nanotubes, graphene, and the like.

In an exemplary embodiment, the first and second sensing lines SL1 andSL2 may include a first portion formed of a double layer including onemetal layer included in the first conductive pattern CP1 and the othermetal layer included in the second conductive pattern CP2, and a secondportion formed of a single layer including only the other metal layer.The first portion and the second portion of each of the first and secondsensing lines SL1 and SL2 will be described in more detail later.

Each of the first sensor patterns SP1 may receive a driving signal fortouch sensing through the corresponding first sensing line SL1, and eachof the second sensor patterns SP2 may transmit a touch sensing signalthrough the corresponding second sensing line SL2. However, theinventive concepts are not limited thereto. For example, in someexemplary embodiments, each of the second sensor patterns SP2 mayreceive the driving signal for touch sensing through the correspondingsecond sensing line SL2, and each of the first sensor patterns SP1 maytransmit the touch sensing signal through the corresponding firstsensing line SL1.

FIG. 8 is an enlarged schematic plan view exemplarily illustrating aregion EA2 of FIG. 5. FIG. 9 is a cross-sectional view taken along lineII-IP of FIG. 8.

In FIG. 8, the region EA2 is shown to have the same size as the regionEA1 of FIG. 6. In particular, the region EA1 and the region EA2 of FIG.5 are shown to have the same size.

Referring to FIGS. 1A to 9, the first and second sensor patterns SP1 andSP2 and the first and second bridge patterns BRP1 and BRP2 may bedisposed in the sensing area SA included in the corner portion of thetouch sensor TS, and the second sensing lines SL2 may be disposed in thenon-sensing area NSA included in the corner portion.

Hereinafter, the sensing area SA included in the corner portion of thetouch sensor TS is referred to as a “corner portion sensing area SA”,and the non-sensing area NSA included in the corner portion of the touchsensor TS is referred to as a “corner portion non-sensing area NSA”.

One first bridge pattern BRP1, two first sensor patterns SP1 connectedby the first bridge pattern BRP1, one second bridge pattern BRP2, andtwo second sensor patterns SP2 connected by the second bridge patternBRP2 may be disposed in the corner portion sensing area SA.

According to an exemplary embodiment, the first and second sensorpatterns SP1 and SP2 and the second bridge pattern BRP2 may be disposedon different layers from the first bridge pattern BRP1. For example, thefirst and second sensor patterns SP1 and SP2 and the second bridgepattern BRP2 may be disposed on the first bridge pattern BRP1 with thefirst insulating layer INS1 interposed therebetween. More particularly,the first and second sensor patterns SP1 and SP2 and the second bridgepattern BRP2 may be formed of the second conductive pattern CP2, and thefirst bridge pattern BRP1 may be formed of the first conductive patternCP1.

A plurality of second sensing lines SL2 may be disposed in the cornerportion non-sensing area NSA. For example, 2a^(th) to 2e^(th) sensinglines SL2_a to SL2_e may be disposed in the corner portion non-sensingarea NSA.

According to an exemplary embodiment, the second sensing lines SL2disposed in the corner portion non-sensing area NSA may be disposed onthe same layer as the first and second sensor patterns SP1 and thesecond bridge pattern BRP2 disposed in the corner portion sensing areaSA, and may include substantially the same material. For example, thesecond sensing lines SL2 may be formed of the second conductive patternCP2. More particularly, the second sensing lines SL2 disposed in thecorner portion non-sensing area NSA may be formed of a single layerincluding only the second conductive pattern CP2.

The second sensing lines SL2 disposed in the corner portion non-sensingarea NSA and the first and second sensor patterns SP1 and SP2 and thefirst and second bridge patterns BRP1 and BRP2 disposed in the cornerportion sensing area SA may be formed through a mask process using aphotoresist pattern.

In general, the second sensing lines SL2 may be formed of a double layerto minimize distortion caused by signal delay. For example, the secondsensing lines SL2 may be formed of a double layer including a firstmetal layer formed of the first conductive pattern CP1 and a secondmetal layer formed of the second conductive pattern CP2 and connected tothe first metal layer. When the second sensing lines SL2 disposed in thecorner portion non-sensing area NSA are formed of a double layer,however, there may be differences in density of the photoresist patternbetween the corner portion non-sensing area NSA and the corner portionsensing area SA. For example, the amount of photoresist pattern used toform the first conductive pattern CP1 during the mask process may begreater in the corner portion non-sensing area NSA than in the cornerportion sensing area SA.

In this case, a greater amount of photoresist may be dissolved during adeveloping process in the corner portion sensing area SA where thephotoresist pattern is disposed at a lower density, than in the cornerportion non-sensing area NSA where the photoresist pattern is disposedat a higher density. As such, the concentration of the developer appliedto the corner portion sensing area SA may be decreased, and aconcentration difference may occur between the developer applied to thecorner portion sensing area SA and the developer of the corner portionnon-sensing area NSA. When the concentration difference of the developerexists between the corner portion sensing area SA and the corner portionnon-sensing area NSA, the high concentration developer can move towardthe low concentration developer by a diffusion principle. As such, thephotoresist pattern of the corner portion sensing area SA isover-developed and the thickness thereof becomes uneven, which may causedefects, for example, short defects of the first bridge pattern BRP1including the first conductive pattern CP1, may occur in the cornerportion sensing area SA.

In particular, since the first bridge pattern BRP1 disposed in thecorner portion sensing area SA is closer to the second sensing lines SL2than the first bridge pattern BRP1 disposed in the other areas exceptthe corner portion of the touch sensor TS, the first bridge pattern BRP1disposed in the corner sensing area SA may be further affected by adensity difference of the photoresist patterns for each area.Accordingly, short defects of the first bridge pattern BRP1 disposed inthe corner portion sensing area SA may occur during the mask processforming the first conductive pattern CP1 at the corner portion of thetouch sensor TS.

In order to compensate for the density difference of the photoresistpattern between the corner portion sensing area SA and the cornerportion non-sensing area NSA, the second sensing lines SL2 disposed inthe corner portion non-sensing area NSA according to an exemplaryembodiment are formed of a single layer including only the secondconductive pattern CP2, instead of a double layer. In this manner, thedensity of the photoresist pattern may be formed uniform for each regionof the touch sensor TS.

As described above, since the second sensing lines SL2 disposed in thecorner portion non-sensing area NSA are formed of a single layerincluding only the second conductive pattern CP2, only the first bridgepattern BRP1 may be formed of the first conductive pattern CP1 among thecomponents disposed at the corner portion of the touch sensor TS, andthe remaining components may be formed of the second conductive patternCP2. In this manner, the corner portion of the touch sensor TS may havea density of a conductive pattern (or metal pattern) that issubstantially the same as or similar to that of the unit sensor blockUSB positioned in one area of the sensing area SA of the touch sensorTS.

FIG. 10 is a schematic plan view of a region of a corner portion of thetouch sensor of FIG. 5 illustrating only a second sensing line and afirst bridge adjacent thereto. FIG. 11 is a cross-sectional view takenalong line of FIG. 10.

In FIG. 10, the first and second sensor patterns and the second bridgepatterns disposed in the sensing area SA of the corner portion of thetouch sensor TS are not illustrated for convenience of description.

In FIG. 10, one corner portion first bridge pattern BRP1′ disposed inthe sensing area SA of the corner portion of the touch sensor TS and twofirst bridge patterns BRP1 disposed in the same column as the cornerportion first bridge pattern BRP1′ are illustrated.

Referring to FIGS. 1A to 11, the corner portion of the touch sensor TSmay include the corner portion sensing area SA where the corner portionfirst bridge pattern BRP1′ is disposed, and the corner portionnon-sensing area NSA where the second sensing lines SL2 are u) disposed.The corner portion non-sensing area NSA may surround the corner portionsensing area SA.

The corner portion first bridge pattern BRP1′ may be formed of the firstconductive pattern CP1 provided and/or formed on the base layer BSL.Among the first bridge patterns BRP1 disposed in the sensing area SA ofthe touch sensor TS, the corner portion first bridge pattern BRP1′ maybe a first bridge pattern BRP1 that is closest to the second sensinglines SL2.

The second sensing lines SL2 may include the 2a^(th) to 2e^(th) sensinglines SL2_a to SL2_e. Each of the 2a^(th) to 2e^(th) sensing lines SL2_ato SL2_e may include a first portion FA formed of a double layerincluding a first metal layer MTL1 and a second metal layer MTL2, and asecond portion MA formed of a single layer including only the secondmetal layer MTL2.

The first portion FA of each of the 2a^(th) to 2e^(th) sensing linesSL2_a to SL2_e may be formed of a double layer including the first metallayer MTL1 and the second metal layer MTL2 provided on the first metallayer MTL1 with the first insulating layer INS1 interposed therebetween.The first metal layer MTL1 and the second metal layer MTL2 may beelectrically and/or physically connected through at least one contacthole CH passing through the first insulating layer INS1. According to anexemplary embodiment, the first metal layer MTL1 may be included in thefirst conductive pattern CP1, and the second metal layer MTL2 may beincluded in the second conductive pattern CP2.

In the first portion FA of each of the 2a^(th) to 2e^(th) sensing linesSL2_a to SL2_e, the first metal layer MTL1 may have substantially thesame size (or area, or length) as the adjacent first metal layer MTL1.For example, the first metal layer MTL1 included in the first portion FAof the 2a^(th) sensing line SL2_a may have substantially the same size(or area, or length) as that of the first metal layer MTL1 of the2b^(th) sensing line SL2_b. The first metal layer MTL1 included in thefirst portion FA of the 2b^(th) sensing line SL2_b may substantiallyhave the same size (or area, or length) as that of the first metal layerMTL1 of the 2c^(th) sensing line SL2_c. The first metal layer MTL1included in the first portion FA of the 2c^(th) sensing line SL2_c mayhave substantially the same size (or area, or length) as that of thefirst metal layer MTL1 of the 2d^(th) sensing line SL2_d. The firstmetal layer MTL1 included in the first portion FA of the 2d^(th) sensingline SL2_d may have substantially the same size (or area, or length) asthat the first metal layer MTL1 of the 2e^(th) sensing line SL2_e.According to an exemplary embodiment, the same size may include one ofthe same width, the same length, or the same thickness.

The second portion MA of each of the 2a^(th) to 2e^(th) sensing linesSL2_a to SL2_e may be formed of a single layer including the secondmetal layer MTL2. In an exemplary embodiment, the second metal layerMTL2 may be included in the second conductive pattern CP2 providedand/or formed on the first insulating layer INS1.

According to an exemplary embodiment, the first portion FA of each ofthe 2a^(th) to 2e^(th) sensing lines SL2_a to SL2_e may not correspondto the corner portion first bridge pattern BRP1′, and the second portionMA of each of the 2a^(th) to 2e^(th) sensing lines SL2_a to SL2_e maycorrespond to the corner portion first bridge pattern BRP1′. Moreparticularly, the 2a^(th) to 2e^(th) sensing lines SL2_a to SL2_e may beformed of a single layer including only the second metal layer MTL2 at aportion corresponding to the corner portion first bridge pattern BRP1′,and may be formed of a double layer including the first metal layer MTL1and the second metal layer MTL2 at a portion not corresponding to thecorner portion first bridge pattern BRP1′. According to an exemplaryembodiment, the second portion MA of the sensing line SL2 being“corresponding” to the corner portion first bridge pattern BRP1′ mayrefer that the second portion MA overlap at least a portion of the firstbridge pattern BRP1′ along a first direction DR1 and/or a seconddirection DR2.

According to an exemplary embodiment, the second metal layer MTL2included in the second portion MA of each of the 2a^(th) to 2e^(th)sensing lines SL2_a to SL2_e may have a different size (or area, orlength) than that of the second metal layer MTL2 included in the secondportion MA of the adjacent second sensing lines SL2. For example, thesize (or area, or length) of the second metal layer MTL2 included in thesecond portion MA of the 2a^(th) sensing line SL2_a closest to thecorner portion first bridge pattern BRP1′ may be the smallest, and thesize (or area, or length) of the second metal layer MTL2 included in thesecond portion MA of the 2e^(th) sensing line SL2_e farthest from thecorner portion first bridge pattern BRP1′ may be the largest. The samesize may include one of the same width, the same length, or the samethickness.

As described above, at the corner portion of the touch sensor TS, onlythe corner portion first bridge pattern BRP1′ may be formed of the firstconductive pattern CP1, and other components, such as the first andsecond sensor patterns SP1 and SP2, the second bridge pattern BRP2, andthe second portion MA of the second sensing lines SL2, may be formed ofthe second conductive pattern CP2.

In this case, when the first conductive pattern CP1 is formed at thecorner portion of the touch sensor TS, an abrupt density differencebetween the photoresist pattern of the corner portion sensing area SAand the photoresist pattern of the corner portion non-sensing area NSAmay be alleviated, so that the density difference in the corner portionsensing area SA and the corner portion non-sensing area NSA may beminimized. Accordingly, defects that may occur due to the densitydifference of the photoresist patterns in the corner portion sensingarea SA and the corner portion non-sensing area NSA may be prevented orat least be suppressed. For example, short defects due to thicknessunevenness of the corner portion first bridge pattern BRP1′ disposed inthe corner portion sensing area SA may be prevented.

In addition, since only the corner portion first bridge pattern BRP1′ atthe corner portion of the touch sensor TS is formed of the firstconductive patterns CP1, the density of the conductive pattern per unitarea between the corner portion of the touch sensor TS and the unitsensor block USB disposed in the sensing area SA except the cornerportion may be similar to each other. As such, sensing sensitivity ofthe touch sensor TS may be increased and reliability may be improved.

FIG. 12 is a plan view of a region of a corner portion of the touchsensor of FIG. 5 illustrating a second sensing line and a first bridgeadjacent thereto according to another exemplary embodiment.

The touch sensor of FIG. 12 is substantially similar to those describedabove, and thus, repeated descriptions of substantially the sameelements thereof will be omitted to avoid redundancy. Same referencenumerals indicate same components, and similar reference numeralsrepresent similar components.

In FIG. 12, the first and second sensor patterns and the second bridgepatterns disposed in the sensing area SA of the corner portion of thetouch sensor TS are not illustrated for convenience of description.

Referring to FIGS. 1A to 7A and 12, the corner portion of the touchsensor TS may include the corner portion sensing area SA in which atleast one corner portion first bridge pattern BRP1′ is disposed, and thecorner portion non-sensing area NSA in which the second sensing linesSL2 are disposed.

The corner portion first bridge pattern BRP1′ may be formed of the firstconductive pattern CP1 provided and/or formed on the base layer BSL.

The second sensing lines SL2 may include the 2a^(th) to 2e^(th) sensinglines SL2_a to SL2_e. Each of the 2a^(th) to 2e^(th) sensing lines SL2_ato SL2_e may be divided into the first portion FA and the second portionMA. In an exemplary embodiment, the first portion FA of each of the2a^(th) to 2e^(th) sensing lines SL2_a to SL2_e may not correspond orpartially corresponds to the corner portion first bridge pattern BRP1′,and the second portion MA of each of the 2a^(th) to 2e^(th) sensinglines SL2_a to SL2_e may correspond to the corner portion first bridgepattern BRP1′.

The first portion FA of each of the 2a^(th) to 2e^(th) sensing linesSL2_a to SL2_e may be formed of a double layer including the first metallayer MTL1 and the second metal layer MTL2 provided on the first metallayer MTL1 with the first insulating layer INS1 interposed therebetweenand connected to the first metal layer MTL1 through the contact hole CH.In an exemplary embodiment, the first metal layer MTL1 may be formed ofthe first conductive pattern CP1, and the second metal layer MTL2 may beformed of the second conductive pattern CP2.

The second portion MA of each of the 2a^(th) to 2e^(th) sensing linesSL2_a to SL2_e may be formed of a single layer including only the secondmetal layer MTL2.

In the first portion FA of each of the 2a^(th) to 2e^(th) sensing linesSL2_a to SL2_e, the first metal layer MTL1 may have a different size (orarea, or length) than that of the adjacent first metal layer MTL1. Forexample, the size (or area, or length) of the first metal layer MTL1included in the first portion FA of the 2a^(th) sensing line SL2_aclosest to the corner portion first bridge pattern BRP1′ may be thesmallest, and the size (or area, or length) of the first metal layerMTL1 included in the first portion FA of the 2e^(th) sensing line SL2_efarthest from the corner portion first bridge pattern BRP1′ (BRP1) maybe the largest. More particularly, the size (or area, or length) of thefirst metal layers MTL1 included in the first portion FA of the secondsensing lines SL2 may be increased as the distance from the cornerportion first bridge pattern BRP1′ is increased. However, the inventiveconcepts are not limited thereto. For example, in some exemplaryembodiments, the size (or area, or length) of the first metal layersMTL1 included in the first portion FA of the second sensing lines SL2may be decreased as the distance from the corner portion first bridgepattern BRP1′ is decreased.

According to an exemplary embodiment, only the corner portion firstbridge pattern BRP1′ may be formed of the first conductive pattern CP1at a portion corresponding to the corner portion first bridge patternBRP1′ of the corner portion of the touch sensor TS, and the remainingcomponents may be formed of the second conductive pattern CP2.

In this case, when the first conductive pattern CP1 is formed at thecorner portion of the touch sensor TS, an abrupt density differencebetween the photoresist pattern of the corner portion sensing area SAand the photoresist pattern of the corner portion non-sensing area NSAmay be alleviated, so that the density difference in the corner portionsensing area SA and the corner portion non-sensing area NSA may beminimized. Accordingly, short defects due to thickness unevenness of thecorner portion first bridge pattern BRP1′ disposed in the corner portionsensing area SA may be prevented.

FIG. 13 is a plan view of a region of a corner portion of the touchsensor of FIG. 5 illustrating a second sensing line and a first bridgeadjacent thereto according to another exemplary embodiment. FIG. 14 is across-sectional view taken along line IV-IV′ of FIG. 13.

The touch sensor of FIGS. 13 and 14 is substantially the same as thosedescribed above, and thus, repeated descriptions of substantially thesame elements thereof will be omitted to avoid redundancy. Samereference numerals indicate same components, and similar referencenumerals represent similar components.

In FIG. 13, the first and second sensor patterns and the second bridgepatterns disposed in the sensing area SA of the corner portion of thetouch sensor TS are not illustrated for convenience of description.

Referring to FIGS. 1A to 7B, 13 and 14, the corner portion of the touchsensor TS may include the corner portion sensing area SA in which atleast one corner portion first bridge pattern BRP1′ is disposed, and thecorner portion non-sensing area NSA in which the second sensing linesSL2 are disposed.

The corner portion first bridge pattern BRP1′ may be formed of the firstconductive pattern CP1 provided and/or formed on the base layer BSL.

The second sensing lines SL2 may include the 2a^(th) to 2e^(th) sensinglines SL2_a to SL2_e. Some of the second sensing lines SL2 may bedivided into the first portion FA formed of a double layer and thesecond portion MA formed of a single layer. The remaining second sensinglines SL2 may be formed of a double layer.

The first portion FA may have a double layer including the first metallayer MTL1 and the second metal layer MTL2 provided on the first metallayer MTL1 with the first insulating layer INS1 interposed therebetweenand connected to the first metal layer MTL1 through the contact hole CH.The second portion MA may have a single layer including only the secondmetal layer MTL2. In an exemplary embodiment, the first metal layer MTL1may be formed of the first conductive pattern CP1, and the second metallayer MTL2 may be formed of the second conductive pattern CP2.

According to the illustrated exemplary embodiment, some of the secondsensing lines SL2 adjacent to the corner portion first bridge patternBRP1′ among the second sensing lines SL2 may include the first portionFA and the second portion MA, and other second sensing lines SL2disposed far from the corner portion first bridge pattern BRP1′ mayinclude only the first portion FA. For example, among the second sensinglines SL2, the 2a^(th) sensing line SL2_a, the 2b^(th) sensing lineSL2_b, and the 2c^(th) sensing line SL2_c, which are adjacent to thecorner portion first bridge pattern BRP1′, may include the first portionFA formed of a double layer including the first metal layer MTL1 and thesecond metal layer MTL2, and the second portion MA formed of a singlelayer including only the second metal layer MTL2. In addition, among thesecond sensing lines SL2, the 2d^(th) sensing line SL2_d and the 2e^(th)sensing line SL2_e, which are disposed far from the corner portion firstbridge pattern BRP1′, may include only the first portion FA formed of adouble layer including the first metal layer MTL1 and the second metallayer MTL2.

When the corner portion first bridge pattern BRP1′ formed of the firstconductive pattern CP1 is formed, the corner portion first bridgepattern BRP1′ may be further affected by the density difference of thephotoresist pattern for each region by the second sensing lines SL2closest to the corner portion first bridge pattern BRP1′. As such,according to the illustrated exemplary embodiment, some of the secondsensing lines SL2 closest to the corner portion first bridge patternBRP1′ among the second sensing lines SL2 may be formed as a single layerincluding only the second metal layer MTL2 at a portion corresponding tothe corner portion first bridge pattern BRP1′.

FIG. 15 is a plan view of a region of a corner portion of the touchsensor of FIG. 5 illustrating a second sensing line and a first bridgeadjacent thereto according to another exemplary embodiment. FIG. 16 is across-sectional view taken along the line V-V′ of FIG. 15.

The touch sensor of FIGS. 15 and 16 is substantially the same as thosedescribed above, and thus, repeated descriptions of substantially thesame elements thereof will be omitted. Same reference numerals indicatesame components, and similar reference numerals represent similarcomponents.

In FIG. 15, the first and second sensor patterns and the second bridgepatterns disposed in the sensing area SA of the corner portion of thetouch sensor TS are not illustrated for convenience of description.

Referring to FIGS. 1A to 9, 15 and 16, the corner portion of the touchsensor TS may include the corner portion sensing area SA in which atleast one corner portion first bridge pattern BRP1′ is disposed, and thecorner portion non-sensing area NSA in which the second sensing linesSL2 are disposed.

The corner portion first bridge pattern BRP1′ may be formed of the firstconductive pattern CP1 provided and/or formed on the base layer BSL.

The second sensing lines SL2 may include the 2a^(th) to 2e^(th) sensinglines SL2_a to SL2_e. Each of the 2a^(th) to 2e^(th) sensing lines SL2_ato SL2_e may be divided into the first portion FA and the second portionMA.

According to an exemplary embodiment, the first portion FA of each ofthe 2a^(th) to 2e^(th) sensing lines SL2_a to SL2_e may not correspondto each of the corner portion first bridge pattern BRP1′ and the firstbridge patterns BRP1 positioned in the same row as the corner portionfirst bridge pattern BRP1′. In addition, the second portion MA of eachof the 2a^(th) to 2e^(th) sensing lines SL2_a to SL2_e may correspond toeach of the corner portion first bridge pattern BRP1′ and the firstbridge patterns BRP1 positioned in the same row as the corner portionfirst bridge pattern BRP1′.

The first portion FA of each of the 2a^(th) to 2e^(th) sensing linesSL2_a to SL2_e may be formed of a double layer including the first metallayer MTL1 and the second metal layer MTL2 provided on the first metallayer MTL1 with the first insulating layer INS1 interposed therebetweenand connected to the first metal layer MTL1 through the contact hole CH.According to an exemplary embodiment, the first metal layer MTL1 may beformed of the first conductive pattern CP1, and the second metal layerMTL2 may be formed of the second conductive pattern CP2.

The second portion MA of each of the 2a^(th) to 2e^(th) sensing linesSL2_a to SL2_e may be formed of a single layer including only the secondmetal layer MTL2.

According an exemplary embodiment, only the corner portion first bridgepattern BRP1′ and the first bridge patterns BRP1 positioned in the samerow as the corner portion first bridge pattern BRP1′ are formed of thefirst conductive pattern CP1 at the corner portion of the touch sensorTS, and the remaining components may be formed of the second conductivepattern CP2.

In the above-described exemplary embodiments, the second sensing linesSL2 of the sensing lines SL disposed in the non-sensing area NSA of thetouch sensor TS are described as including the first portion FA and thesecond portion MA. However, the inventive concepts are not limitedthereto. For example, in some exemplary embodiments, the first sensinglines SL1 may also include the first portion FA and the second portionMA, which will be described in more detail below.

FIG. 17 is a plan view of a region of a corner portion of the touchsensor of FIG. 5 illustrating a first sensing line and a first bridgeadjacent thereto. FIG. 18 is a cross-sectional view taken along lineVI-VI′ of FIG. 17.

The touch sensor of FIGS. 17 and 18 is substantially the same as thosedescribed above. As such, repeated descriptions of the substantially thesame elements thereof will be omitted. Same reference numerals indicatesame components, and similar reference numerals represent similarcomponents.

In FIG. 17, the first and second sensor patterns and the second bridgepatterns disposed in the sensing area SA of the corner portion of thetouch sensor TS are not illustrated for convenience of description.

Referring to FIGS. 1A to 7B, 17 and 18, the corner portion of the touchsensor TS may include the corner portion sensing area SA in which atleast one corner portion first bridge pattern BRP1′ is disposed, and thecorner portion non-sensing area NSA in which the first sensing lines SL1are disposed. The corner portion non-sensing area NSA may surround thecorner portion sensing area SA.

The corner portion first bridge pattern BRP1′ may be formed of the firstconductive pattern CP1 provided and/or formed on the base layer BSL. Thecorner portion first bridge pattern BRP1′ may be the first bridgepatterns BRP1 closest to the first sensing lines SL1 among the firstbridge patterns BRP1 disposed in the sensing area SA of the touch sensorTS.

The first sensing lines SL1 may include 1a^(th) to 1f^(th) sensing linesSL1_a to SL1_f. Each of the 1a^(th) to 1f^(th) sensing lines SL1_a toSL1_f may include the first portion FA formed of a double layerincluding a third metal layer MTL3 and a fourth metal layer MTL4, andthe second portion MA formed of a single layer including only the fourthmetal layer MTL4.

According to an exemplary embodiment, each of the 1a^(th) to 1f^(th)sensing lines SL1_a to SL1_f may be divided into the first portion FAand the second portion MA.

The first portion FA of each of the 1a^(th) to 1f^(th) sensing linesSL1_a to SL1_f may be formed of a double layer including the third metallayer MTL3 and the fourth metal layer MTL4 provided on the third metallayer MTL3 with the first insulating layer INS1 interposed therebetween.The third metal layer MTL3 and the fourth metal layer MTL4 may beelectrically and/or physically connected through at least one contacthole CH passing through the first insulating layer INS1. The third metallayer MTL3 may be included in the first conductive pattern CP1, and thefourth metal layer MTL4 may be included in the second conductive patternCP2.

According to an exemplary embodiment, the third metal layer MTL3 of eachof the first sensing lines SL1 may be provided on the same layer as thefirst metal layer MTL1 (see FIG. 10) of the second sensing lines SL2.The third metal layer MTL3 of each of the first sensing lines SL1 mayinclude substantially the same material as the first metal layer MTL1(see FIG. 10) of the second sensing lines SL2 and may be formed throughthe same process. In addition, the third metal layer MTL3 of each of thefirst sensing lines SL1 may be provided on the same layer as the cornerportion first bridge pattern BRP1′. The third metal layer MTL3 of eachof the first sensing lines SL1 may include substantially the samematerial as the corner portion first bridge pattern BRP1′ and may beformed through the same process.

The fourth metal layer MTL4 of each of the first sensing lines SL1 maybe provided on the same layer as the second metal layer MTL2 (see FIG.10) of the second sensing lines SL2. The fourth metal layer MTL4 of eachof the first sensing lines SL1 may include substantially the samematerial as the second metal layer MTL2 (see FIG. 10) of the secondsensing lines SL2 and may be formed through the same process. Inaddition, the fourth metal layer MTL4 of each of the first sensing linesSL1 may be provided on the same layer as the first and second sensorpatterns SP1 and SP2 and the second bridge patterns BRP2 disposed in thesensing area SA of the touch sensor TS. The fourth metal layer MTL4 ofeach of the first sensing lines SL1 may include substantially the samematerial as the first and second sensor patterns SP1 and SP2 and thesecond bridge patterns BRP2 disposed in the sensing area SA of the touchsensor TS and may be formed through the same process.

In the first portion FA of each of the 1a^(th) to 1f^(th) sensing linesSL1_a to SL1_f, the third metal layer MTL3 may have substantially thesame size (or area, or length) as the adjacent third metal layer MTL3.

The second portion MA of each of the 1a^(th) to 1f^(th) sensing linesSL1_a to SL1_f may be formed of a single layer including only the fourthmetal layer MTL4.

According to an exemplary embodiment, the first portion FA of each ofthe 1a^(th) to 1f^(th) sensing lines SL1_a to SL1_f may not correspondto the corner portion first bridge pattern BRP1′, and the second portionMA of each of the 1a^(th) to 1f^(th) sensing lines SL1_a to SL1_f maycorrespond to the corner portion first bridge pattern BRP1′. Moreparticularly, the 1a^(th) to 1f^(th) sensing lines SL1_a to SL1_f may beformed of a single layer including only the fourth metal layer MTL4 at aportion corresponding to the corner portion first bridge pattern BRP1′,and may be formed of a double layer including the third metal layer MTL3and the fourth metal layer MTL4 at a portion not corresponding to thecorner portion first bridge pattern BRP1′.

According to an exemplary embodiment, the fourth metal layer MTL4included in the second portion MA of each of the 1a^(th) to 1f^(th)sensing lines SL1_a to SL1_f may have a different size (or area, orlength) than that of the fourth metal layer MTL4 included in the secondportion MA of the adjacent first sensing lines SL1. For example, thesize (or area, or length) of the fourth metal layer MTL4 included in thesecond portion MA of the 1a^(th) sensing line SL1_a closest to thecorner portion first bridge pattern BRP1′ may be smallest, and the size(or area, or length) of the fourth metal layer MTL4 included in thesecond portion MA of the 1f^(th) sensing line SL1_f disposed farthestfrom the corner portion first bridge pattern BRP1′ may be the largest.More particularly, the size (or area, or length) of the fourth metallayers MTL1 included in the second portion MA of the first sensing linesSL1 may be increased as the distance from the corner portion firstbridge pattern BRP1′ is increased.

As described above, only the corner portion first bridge pattern BRP1′may be formed of the first conductive pattern CP1 at the corner portionof the touch sensor TS, and the remaining components, such as the firstand second sensor patterns SP1 and SP2, the second bridge pattern BRP2,and the second portion of the first sensing lines SL1, may be formed ofthe second conductive pattern CP2.

In this case, when the first conductive pattern CP1 is formed at thecorner portion of the touch sensor TS, an abrupt density differencebetween the photoresist pattern of the corner portion sensing area SAand the photoresist pattern of the corner portion non-sensing area NSAmay be alleviated, so that the density difference in the corner portionsensing area SA and the corner portion non-sensing area NSA may beminimized. Accordingly, defects that may occur due to the densitydifference of the photoresist patterns in the corner portion sensingarea SA and the corner portion non-sensing area NSA may be prevented.For example, short defects due to thickness unevenness of the cornerportion first bridge pattern BRP1′ disposed in the corner portionsensing area SA may be prevented.

In the touch sensor according to the exemplary embodiments and thedisplay device having the same, at least one sensing line adjacent to abridge positioned at a corner portion of the sensing area may be formedof a single layer. In this manner, short defects of the bridge may beprevented to improve sensing sensitivity at the corner portion.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A touch sensor comprising: a base layer includinga sensing area and a non-sensing area; a plurality of first sensorpatterns disposed in the sensing area and arranged along a firstdirection; a plurality of first bridge patterns arranged along the firstdirection, at least one of the first bridge patterns being disposed at acorner portion of the sensing area; a plurality of second sensorpatterns disposed in the sensing area and arranged along a seconddirection crossing the first direction; a plurality of second bridgepatterns arranged along the second direction; and a plurality of sensinglines disposed in the non-sensing area and connected to each of thefirst and second sensor patterns, wherein each of the sensing linesincludes a first metal layer and a second metal layer disposed on thefirst metal layer with an insulating layer interposed therebetween,wherein each of the sensing lines has a first portion and a secondportion, the second portion corresponding to the at least one of thefirst bridge patterns, and wherein the second portion of at least one ofthe sensing lines has a single layer structure including only the secondmetal layer.
 2. The touch sensor of claim 1, wherein the first bridgepatterns are disposed on a layer different from a layer on which thefirst and second sensor patterns and the second bridge patterns aredisposed.
 3. The touch sensor of claim 2, wherein the first metal layeris disposed on the same layer as the first bridge patterns, and thesecond metal layer is disposed on the same layer as the first and secondsensor patterns and the second bridge patterns.
 4. The touch sensor ofclaim 3, wherein the insulating layer includes at least one contacthole, and the first metal layer and the second metal layer areelectrically connected through the at least one contact hole.
 5. Thetouch sensor of claim 4, wherein the first portion of the at least oneof the sensing lines has a double layer structure including the firstmetal layer and the second metal layer overlapping the first metallayer.
 6. The touch sensor of claim 4, wherein the first portion of eachof the sensing lines has a double layer structure including the firstmetal layer and the second metal layer disposed on the first metallayer.
 7. The touch sensor of claim 6, wherein: the first metal layer ofeach of the sensing lines has the same size; and the same size includesone of the same width, the same length, or the same thickness.
 8. Thetouch sensor of claim 6, wherein the first metal layer of each of thesensing lines has a different size from each other.
 9. The touch sensorof claim 8, wherein the size of the first metal layer of each of thesensing lines increases as being disposed further away from the sensingarea.
 10. The touch sensor of claim 4, wherein the second portion ofeach of the sensing lines has a single layer structure including onlythe second metal layer.
 11. The touch sensor of claim 10, wherein: thesecond metal layer of each of the sensing lines has the same size; andthe same size includes one of the same width, the same length, or thesame thickness.
 12. The touch sensor of claim 10, wherein the secondmetal layer of each of the sensing lines has a different size from eachother.
 13. The touch sensor of claim 4, wherein the second portionoverlaps the at least one of the first bridge patterns along the firstdirection.
 14. The touch sensor of claim 4, wherein: each of the sensinglines includes a third portion and a fourth portion extending in thefirst direction; the third portion corresponds to the first bridgepatterns disposed in the same column as the at least one of the firstbridge patterns; and the third portion has a single layer structureincluding only the second metal layer.
 15. The touch sensor of claim 14,wherein the fourth portion of each of the sensing lines that does notcorrespond to the first bridge patterns disposed in the same column asthe at least one of the first bridge patterns has a double layerstructure including the first metal layer and the second metal layerdisposed on the first metal layer.
 16. A display device comprising: adisplay panel including a plurality of pixels and an encapsulating layerdisposed on the plurality of pixels, each of the plurality of pixelsincluding a light emitting element; and a touch sensor disposed on theencapsulating layer, the touch sensor including: a base layer includinga sensing area and a non-sensing area; a plurality of first sensorpatterns disposed in the sensing area and arranged along a firstdirection; a plurality of first bridge patterns arranged along the firstdirection, at least one of the first bridge patterns being disposed at acorner portion of the sensing area; a plurality of second sensorpatterns disposed in the sensing area and arranged along a seconddirection crossing the first direction; a plurality of second bridgepatterns arranged along the second direction; and a plurality of sensinglines disposed in the non-sensing area and connected to each of thefirst and second sensor patterns, wherein each of the sensing linesincludes a first metal layer and a second metal layer disposed on thefirst metal layer with an insulating layer interposed therebetween,wherein each of the sensing lines has a first portion and a secondportion, the second portion corresponding to the at least one of thefirst bridge patterns, and wherein the second portion of at least one ofthe sensing lines has a single layer structure including only the secondmetal layer.
 17. The display device of claim 16, wherein the first metallayer is disposed on the same layer as the first bridge patterns, andthe second metal layer is disposed on the same layer as the first andsecond sensor patterns and the second bridge patterns.
 18. The displaydevice of claim 17, wherein the first portion of each of the sensinglines has a double layer structure including the first metal layer andthe second metal layer disposed on the first metal layer.
 19. Thedisplay device of claim 18, wherein: the first metal layer of each ofthe sensing lines has the same size; and the same size includes one ofthe same width, the same length, or the same thickness.
 20. The displaydevice of claim 16, wherein the display panel includes a substrateincluding a display area provided with the plurality of pixels and anon-display area disposed on at least one side of the display area,wherein each of the plurality of pixels comprises: a pixel circuit layerdisposed on the substrate and including at least one transistor; and adisplay element layer disposed on the pixel circuit layer and includingthe light emitting element emitting light, and wherein the encapsulationlayer is disposed on the display element layer.